适用工件： (Applicable parts) | 6寸/8寸蓝宝石或碳化硅 6"/8“Sapphire or SiC Wafer |
| 批量产能： (Capacity) | 60s/pcs |
工艺流程： (Procedure Flow) | 上料→ 晶圆定位→旋转刷洗及二流体喷洗(硅面)→翻转180度→旋转刷洗、兆声波喷洗(碳面)→旋转甩干→下料 Load→Location→Rotation,brushing,cleaning,two-fluid spraying(Si side)→Turn over 180 degree→Rotation, brushing,cleaning,megasonic spraying(C side)→Rotation, Spin-Drying→Unload |
| 主要材料： (Major Material) | 金属骨架+PP瓷白壳板 Metal Frame+PP white board |
| 运送方式： (Transportation) | 通过洁净机械手进行晶圆传输 Wafer transported by clean robotic hand |
工艺效果： (Process effect) | a.particle size0.3~0.5um,remove %>90%or <200e.a; b.particle size0.5~1um,remove%>95%or <10e.a。 PS:inspection machine is for Candela or SICA |
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