| 适用工件： (Applicable parts) | 8寸/12寸，φ200/300mm,厚度0.5-1.00mm晶圆片 (8/12 Inches,φ200/300mm,thickness:0.5-1mm Wafer) |
| 批量产能： (Capacity) | Max:25pcs/min |
| 工艺流程： (Procedure flow) | LOAD(手动/Manual)→涤纶正反面滚刷(Polyester Bushig both sides)→PVA正反面滚刷(PVC Bushing both sides→装篮(Insert to cassette)→超声清洗 (Ultrasonic Clean)→UNLOAD(手动/Manual) |
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